High-strength, high-conductivity copper alloy

Details High-strength, high-conductivity copper alloy High-strength, high-conductivity copper alloy

1986-03-25

1987-05-19

Brody, Christopher W.

Alloys or metallic compositions

Copper base

Tin containing

420472, 420473, 420475, 420494, C22C 902

Patent

active

046666672

ABSTRACT:
A high-strength, high-conductivity copper alloy comprises, all by weight, from 0.8 to 4.0% of Sn, from more than 0.01 to 0.4% of P, from 0.05 to 1.0% of Ni, from 0.05 to 1.0% of one, two or more elements selected from Al, Hf, Be, Mo, Zn, Te, Pb, Co, Zr, and Nb, and the remainder of Cu and inevitable impurities. The impurities include not more than 0.0020% of oxygen.

REFERENCES:
patent: 4486250 (1984-12-01), Nakajima
Copper Development Association, Inc., Greenich Office Park 2, Box 1840, Greenwich, CT 06836-1840, "Application Data Sheet".

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