High strength gold wire for microelectronics miniaturization and

Details High strength gold wire for microelectronics miniaturization and High strength gold wire for microelectronics miniaturization and

1998-02-17

1999-06-22

Jenkins, Daniel J.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Metal and nonmetal in final product

419 28, 419 38, 419 49, 419 3, B22F 314, B22F 316, B22F 324, C22C 502

Patent

active

059151609

ABSTRACT:
High strength gold wire for use in microelectronics and a method of producing the same are disclosed. In the methods of the present invention, a gold alloy having gold and a dilute rare earth (RE) element is produced. Next, the gold alloy is atomized into a powder. The dilute RE element is at least partially oxidized during atomization. Then, the powder is consolidated into an oxide dispersion strengthened gold billet. Finally, gold wire is formed from the oxide dispersion strengthened gold billet. The high strength gold wire can be drawn to a diameter less than conventional gold wire, while still maintaining mechanical and electrical properties, thereby facilitating microelectronics miniaturization.

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Of Material Interest-Au-Ti Wire Strengthens At Room Temperature, Advanced Materials & Process, p. 4 (Date unknown).
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