Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Patent
1995-03-31
1997-08-05
Bradley, P. Austin
Metal fusion bonding
Including means to force or clamp work portions together...
Work portion comprises electrical component
228 51, 228 54, B23K 303, H01L 21603
Patent
active
056533764
ABSTRACT:
The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool). The tool is used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool has a substrate that is composed of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and having a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree.C. at room temperature to 400.degree. C. Furthermore, a polycrystalline diamond coating is formed on the surface having microscopic protrusions by a gaseous phase synthesis method, the surface coated with the polycrystalline diamond coating being used as a tool end surface.
REFERENCES:
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patent: 4997121 (1991-03-01), Yoshimura
patent: 5197651 (1993-03-01), Nakamura et al.
patent: 5213248 (1993-05-01), Horton et al.
Kawauchi Hiroshi
Nakai Tetsuo
Nakamura Tsutomu
Bradley P. Austin
Knapp Jeffrey T.
Sumitomo Electric Industries Inc.
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