High strength bonding tool and a process for production of the s

Details High strength bonding tool and a process for production of the s High strength bonding tool and a process for production of the s

1997-04-24

1999-08-10

Ryan, Patrick

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228 51, 228 54, B23K 2002

Patent

active

059345420

ABSTRACT:
The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool) used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool comprises a substrate consisting of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree. C. at room temperature to 400.degree. C. and a polycrystalline diamond coating formed on the above described surface having microscopic protrusions by a gaseous phase synthesis method, the surface coated with the polycrystalline diamond coating being used as a tool end surface.

REFERENCES:
patent: 5197651 (1993-03-01), Nakamura et al.
patent: 5213248 (1993-05-01), Horton et al.
patent: 5370299 (1994-12-01), Tanabe et al.
patent: 5425491 (1995-06-01), Tanaka et al.

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