High-stability microencapsulated hardened for epoxy resin...

Details High-stability microencapsulated hardened for epoxy resin... High-stability microencapsulated hardened for epoxy resin...

2006-09-29

2010-12-21

McGinty, Douglas (Department: 1796)

Compositions

Electrically conductive or emissive compositions

C525S523000, C524S183000, C428S042200, C523S211000, C106S287300, C429S129000

Reexamination Certificate

active

07854860

ABSTRACT:
A microencapsulated latent hardener for epoxy resins which comprises cores (C) and shells (S) with which the cores are covered, characterized in that the cores (C) are ones formed from, as a starking material, particles of an epoxy resin hardener (H) comprising an amine adduct (A) and a low-molecular amine compound (B) as major ingredients and that the shells (S) have on the surface thereof connecting groups (x), (y), and (z) which absorb infrared. Also provided is an epoxy resin composition containing the hardener.

REFERENCES:
patent: 4833226 (1989-05-01), Ishimura et al.
patent: 5357008 (1994-10-01), Tsai et al.
patent: 5548058 (1996-08-01), Muroi et al.
patent: 5589523 (1996-12-01), Sawaoka et al.
patent: 6555602 (2003-04-01), Harada et al.
patent: 6805958 (2004-10-01), Nakamura et al.
patent: 2006/0128835 (2006-06-01), Usui et al.
patent: 2008/0251757 (2008-10-01), Yamamoto et al.
patent: 2009/0186962 (2009-07-01), Kondo et al.
patent: 1 557 438 (2005-07-01), None
patent: 64-70523 (1989-03-01), None
patent: 5-331264 (1993-12-01), None
patent: 2005-344046 (2005-12-01), None
patent: 305860 (1997-05-01), None
patent: 200410998 (2004-07-01), None
patent: WO 2004/037885 (2004-05-01), None
Office Action issued on Mar. 10, 2010 in a corresponding Chinese Application (200680036309.X).
Yongquan Lu et al., “Practical Infrared Spectra Analysis,” Publishing House of Electronics Industry, 1989, pp. 148, 159 & 162.

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