High-speed wire wrap board

Details High-speed wire wrap board High-speed wire wrap board

1982-01-28

1985-01-15

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 361307, 361414, H05K 102

Patent

active

044941722

ABSTRACT:
A panel board has a first voltage layer sandwiched between two ground layers at a close spacing to produce a large distributed capacitance; the two ground layers are connected by plated-through conductive holes spaced regularly across the board; a second (exposed) voltage layer is connected by regularly spaced plated-through holes to the first voltage layer, increasing the current carrying capacity of, and reducing the resistance across, the board; the plated-through holes are arranged in rows and columns in a pattern permitting the mounting of decoupling capacitors, at any point on the board, in a position parallel to the rows or parallel to the columns; and a socket terminal can be electrically connected directly to the exposed voltage layer or to the exposed ground layer using a ring connector.

REFERENCES:
patent: 1671148 (1928-05-01), Deutschmann
patent: 3250848 (1966-05-01), Beelitz et al.
patent: 3324224 (1967-06-01), Thibodeau
patent: 3344515 (1967-10-01), Schuster et al.
patent: 3351816 (1967-11-01), Sear et al.
patent: 3398326 (1968-08-01), Swart et al.
patent: 3568000 (1971-03-01), D'Aboville
patent: 3680005 (1972-07-01), Jorgeson et al.
patent: 3895435 (1975-07-01), Turner et al.
patent: 3932932 (1976-01-01), Goodman
patent: 4004196 (1977-01-01), Doucet
patent: 4054939 (1977-10-01), Ammon
patent: 4330684 (1982-05-01), Hayward
patent: 4362899 (1982-12-01), Borill

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