High speed wire bonding method

Details High speed wire bonding method High speed wire bonding method

1981-05-04

1982-07-20

Goldberg, Howard N.

Metal fusion bonding

Process

Plural joints

228 45, B23K 3102

Patent

active

043401660

ABSTRACT:
A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a simiconductor and is accelerated toward the electrode. Shortly before the bonding tool reaches the electrode, the bonding tool is moved toward the electrode at a substantially linear predetermined velocity so that the bonding tool imparts a controlled kinetic energy to the wire as a first bonding force, a second predetermined preload bonding force is applied to the bonding tool at the time of engagement and subsequently a third and final predetermined bonding force is applied to the bonding tool to bond the fine wire to the electrode at high speeds.

REFERENCES:
patent: 3641660 (1972-02-01), Adams et al.
patent: 3643321 (1972-02-01), Field et al.
patent: 3940047 (1976-02-01), Laub et al.

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