Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1982-02-22
1983-11-08
Wityshyn, Michael G.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156181, 156296, 1565801, 1565802, 264 23, 4251742, B29C 2708, B32B 3120
Patent
active
044140452
ABSTRACT:
A method and apparatus provide the production of a non-woven fabric from a batt of random, loose, ultrasonically fusible fibers at high speed (e.g. greater than 50 meters/minute). A plurality of ultrasonic welding machines are spaced from each other in a batt feed direction, and produce a fabric having a predetermined number of primary bonding points per unit area. The batt is fed in the feed direction into operative engagement, in turn, with each of the ultrasonic welding machines, while energy is supplied to each of the machines. Each of the machines effects bonding of substantially less than all of the predetermined number of primary bonding points, but so that together the machines provide all of the predetermined number of bonding points. Each machine includes an anvil roller and a purality of horns, which may be disposed in-line with each other and spaced from each other in a dimension transverse to the feed direction. Each machine preferably bonds the same number of the bonding points per unit area, and each anvil roller may have a pattern identical to the patterns of the anvil rollers of the other machines, only offset in the dimension perpendicular to the feed direction.
REFERENCES:
patent: 3733238 (1973-05-01), Long et al.
patent: 3836413 (1974-09-01), Frohlich et al.
patent: 4259399 (1981-03-01), Hill
patent: 4311540 (1982-01-01), Hill
Hill Berlie R.
Pinson, Jr. Marvin J.
Wang Kenneth Y.
Burlington Industries Inc.
Wityshyn Michael G.
LandOfFree
High speed ultrasonic bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High speed ultrasonic bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed ultrasonic bonding will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2006201