High speed tin, lead or tin/lead alloy electroplating

Details High speed tin, lead or tin/lead alloy electroplating High speed tin, lead or tin/lead alloy electroplating

1989-09-20

1991-02-19

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 444, 204 53, 204 541, C25D 332, C25D 336, C25D 360

Patent

active

049941550

ABSTRACT:
An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or (2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of less than six carbon atoms.

REFERENCES:
patent: 4459185 (1984-07-01), Obata et al.
patent: 4617097 (1986-10-01), Nobel et al.
patent: 4880507 (1989-11-01), Toben et al.

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