High speed temporary package and interconnect for testing semico

Details High speed temporary package and interconnect for testing semico High speed temporary package and interconnect for testing semico

1996-12-31

1998-11-10

Brock, Michael

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3102

Patent

active

058349456

ABSTRACT:
An improved interconnect for semiconductor dice, a method for testing dice using the interconnect, and a method for fabricating the interconnect are provided. The interconnect includes dense arrays of contact members configured to establish temporary electrical communication with contact locations on a die under test. In addition, the interconnect includes patterns of multi level conductors formed on different levels of the substrate and separated by insulating layers. The multi level conductors can be formed with a higher density and with less cross talk than planar conductors to permit high speed testing of dice having a large number of bond pads. The interconnect can be configured for use with a temporary package for housing a single die for burn-in or other testing. Electrical paths between terminal contacts on the package and the multi level conductors on the interconnect can be formed by microbump tape having low resistance microbumps bonded to the multi level conductors.

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