Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-11-14
1999-11-09
Lee, Thomas C.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
710126, 710131, G06F 13121
Patent
active
059826347
ABSTRACT:
A compact, high speed switch packaging arrangement or package provides reduced path lengths for electrical paths through the package. In particular, a printed circuit board switch backplane supports a switching subsystem and connects the switching subsystem to pairs of electrical connectors with the pairs of connectors being positioned on opposite edges of the same side of the backplane. A plurality of port boards for processing signals to be switched by the switching subsystem each include pairs of connectors which intermate with the pairs of connectors on the backplane. Port circuitry on the port boards is connected to the port board connectors to minimize trace lengths on the port boards by routing ports to the nearest one of the two connectors. The port boards are mounted to the backplane such that signals from the port boards are routed to the switching subsystem from two opposite sides of the switching subsystem. This routing results in a star or radiating pattern of trace paths on the backplane to reduce trace lengths. Further, since the connectors on the backplane are placed on opposite sides of the switching subsystem, the port boards coupled with the connectors can extend over and above that portion of the backplane which supports the switching subsystem thereby placing the connectors as close as possible to the switching subsystem and, in turn, further reducing trace lengths on the backplane.
REFERENCES:
patent: 4736124 (1988-04-01), McFarland, Jr.
patent: 4947288 (1990-08-01), Olsson
patent: 4975695 (1990-12-01), Almond et al.
patent: 5119273 (1992-06-01), Corda
patent: 5428806 (1995-06-01), Pocrass
patent: 5446621 (1995-08-01), Jansen et al.
patent: 5488541 (1996-01-01), Mistry et al.
patent: 5530811 (1996-06-01), Benton et al.
patent: 5568361 (1996-10-01), Ward et al.
patent: 5603044 (1997-02-01), Annapareddy et al.
patent: 5696667 (1997-12-01), Berding
Elamin Abdelmoniem L.
Lee Thomas C.
Systran Corporation
LandOfFree
High speed switch package provides reduced path lengths for elec does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High speed switch package provides reduced path lengths for elec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed switch package provides reduced path lengths for elec will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1464966