High-speed signal transmission structure having parallel...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C361S792000

Reexamination Certificate

active

07449641

ABSTRACT:
A high-speed signal transmission structure having parallel disposed and serially connected vias is disclosed. The structure is applicable to a multi-layered circuit board such as a high-speed digital circuit board for forming a high-speed signal transmission circuit on the high-speed digital circuit board. The structure includes a pair of parallel disposed and serially connected vias for connecting an upper conductive circuit installed on an upper layer of the multi-layered circuit board and a lower conductive circuit installed on a lower layer of the multi-layered circuit board. Compared with the prior art, an open stub formed by the remaining portion of the vias has become shorter, thereby reducing a resonance effect affecting the quality of signal transmission.

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