High speed pull test device and method

Details High speed pull test device and method High speed pull test device and method

2005-03-17

2010-12-28

Caputo, Lisa M (Department: 2855)

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

Reexamination Certificate

active

07856889

ABSTRACT:
A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces.

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The International Search Report for PCT Application No. PCT/GB2005/001116; Filed Mar. 17, 2005; Date of Completion Jan. 11, 2006; Date of Mailing Jan. 18, 2006.

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