High speed precision chuck assembly

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

269 55, 324 725, G01R 3102, B23Q 114

Patent

active

039367436

ABSTRACT:
Testing of integrated circuit components of the silicon wafer type for grading purposes is accomplished by supporting the wafer matrix on a platform type work table which is indexed in an x-y coordinate fashion, with the work table being moved vertically to a test position such that the test probes make contact with a precise predetermined position corresponding to the precise location of that portion of the integrated circuit to be tested. The work table is movable vertically with reference to a predetermined axis and rotatable with respect thereto such that the surface of the table remains perpendicular to the reference axis. The chuck assembly for moving the table includes a housing having a bore whose center forms the axis, with a chuck plate mounted for sliding movement in the bore. The end of the chuck plate is in the form of a flanged spool which receives bearing-eccentric assembly for effecting vertical movement while permitting rotation of the spool and the attached chuck plate. A multiphase stepping motor is used to drive the chuck plate through the bearing-eccentric assembly, the motor including optical limit switches sensing the motor shaft position and controlling the motor operation. The motor has a sinusoidal speed characteristic and uniformly decelerates as the table reaches the predetermined reference position. A vacuum assembly is used to provide a pressure differential across the table, the chuck assembly being electrically grounded to prevent interference with testing of wafers. Also described is an angular orientation system by which the rotation of the table may be controlled.

REFERENCES:
patent: 3810017 (1974-05-01), Wiesler et al.
DeGroodt et al., Mechanical Evaluation Machine; IBM Tech. Dis. Bull.; Jan. 1971, pp. 2298, 2299.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High speed precision chuck assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High speed precision chuck assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed precision chuck assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2124396

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.