Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2006-04-04
2006-04-04
Everhart, Caridad (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S031000, C257S431000
Reexamination Certificate
active
07022544
ABSTRACT:
A structure (and method for forming the structure) includes a photodetector, a substrate formed under the photodetector, and a barrier layer formed over the substrate. The buried barrier layer preferably includes a single or dual p-n junction, or a bubble layer for blocking or eliminating the slow photon-generated carriers in the region where the drift field is low.
REFERENCES:
patent: 3990059 (1976-11-01), Carlo et al.
patent: 4875084 (1989-10-01), Tohyama
patent: 5285078 (1994-02-01), Mimura et al.
patent: 5318676 (1994-06-01), Sailor et al.
patent: 5525828 (1996-06-01), Bassous et al.
patent: 5696629 (1997-12-01), Berger et al.
patent: 6177289 (2001-01-01), Crow et al.
patent: 6265823 (2001-07-01), Dobson et al.
patent: 6451702 (2002-09-01), Yang et al.
patent: 6683367 (2004-01-01), Stalmans et al.
patent: 2003/0094664 (2003-05-01), Yagi
patent: 1065206 (1998-03-01), None
patent: 2002203983 (2002-07-01), None
Min Yang et al., “A CMOS-Compatible High-Speed Silicon Lateral Trench Photodetector”, Proceedings of the 59th DRC (2001), pp. 153-154.
Jacob Y.L. Ho et al., “High-speed and high-sensitivity silicon-on-insulator metal-semiconductor-metal photodetector with trench structure”, Dept. of Physics, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, May 6, 1996, Appl. Phys. Lett. 69 (1), pp. 16-18.
Min Yang et al., “High Speed Silicon Lateral Trench Detector on SOI Substrate”, IEDM, paper 24-1 (2001), pp. 1-4.
S.J. Koester et al., “1.1 GHz MSM Photodiodes on Relaxed Sil-xGex Grown by UHV-CVD”, IEDM, paper 24-1 (2001), 1998 DRC pp. 60-61 (2001).
T.K. Woodward et al., “1-Gb/s Integrated Optical Detectors and Receivers in Commercial CMOS Technologies”, IEEE Journal of Selected Topics in Quantum Electronics, vol. 5, No. 2, Mar./Apr., 1999, pp. 146-156.
Phillippe Lalanne et al., “CMOS photodiodes based on vertical p-n-p junctions”, Workshop on Optics and Computer Science, Proc. 11th Int. Parallel Processing, Symp., Geneva, Switzerland Apr. 15, 1997, pp. 1-8.
Kwark, et al., “Silicon-on-Insulator (SOI) Trench Photodiode and Method of Forming Same”, U.S. Appl. No. 09/678,315.
Philippe Lalanne, et al., “CMOS Photodiodes Based on Vertical p-n-p Junctions”, Institut d'Optique Theorique et Appliquee, 1977, pp. 1-8.
Cohen Guy Moshe
Ouyang Qiqing C.
Schaub Jeremy Daniel
Abzug, Esq. Jesse L.
Everhart Caridad
McGinn IP Law Group PLLC
LandOfFree
High speed photodiode with a barrier layer for blocking or... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High speed photodiode with a barrier layer for blocking or..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed photodiode with a barrier layer for blocking or... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3563135