High speed optoelectronic subassembly and package for...

Details High speed optoelectronic subassembly and package for... High speed optoelectronic subassembly and package for...

2007-04-17

2007-04-17

Vanderpuye, Kenneth (Department: 2613)

Optical communications

Transmitter

C372S043010, C398S164000, C398S201000, C385S014000, C385S092000, C385S093000, C257S079000, C257S734000

Reexamination Certificate

active

10701774

ABSTRACT:
A high speed optoelectronic subassembly in an optoelectronic package is disclosed that includes a dielectric support having a first electrical trace on a surface thereof and a dielectric member mounted on the surface of the support having a second electrical trace thereon. The support extends laterally a distance greater than the member to form a shelf. A dielectric step is positioned on the shelf abutting an end of the member and a laser is positioned on the shelf adjacent the step so as to be light accessible external to the subassembly. The laser and the step have surfaces equal in height and cooperate to provide a mounting platform. A resistive element is positioned on the mounting platform and electrically connected to the laser, the resistive element and laser being electrically externally accessible through the traces.

REFERENCES:
patent: 4733932 (1988-03-01), Frenkel et al.
patent: 4989930 (1991-02-01), Nakagawa et al.
patent: 2002/0012369 (2002-01-01), Nasu et al.
patent: 2002/0142626 (2002-10-01), Smeltz, Jr.

Affiliated with

Also associated with

Rating

High speed optoelectronic subassembly and package for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High speed optoelectronic subassembly and package for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed optoelectronic subassembly and package for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3728095