High speed method of aligning cutting lines of a workplace...

Details High speed method of aligning cutting lines of a workplace... High speed method of aligning cutting lines of a workplace...

2006-03-21

2006-03-21

Eley, Timothy V. (Department: 3724)

Stone working

Sawing

Rotary

C083S425200, C083S471300, C125S013010, C451S190000, C451S194000

Reissue Patent

active

RE039018

ABSTRACT:
Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mecha- nisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.

REFERENCES:
patent: 4416312 (1983-11-01), Ostberg
patent: 4688540 (1987-08-01), Ono
patent: 5842461 (1998-12-01), Azuma
patent: 59-156753 (1984-10-01), None
patent: 1-285805 (1989-11-01), None
patent: 4-363047 (1992-12-01), None

Affiliated with

Also associated with

Rating

High speed method of aligning cutting lines of a workplace... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High speed method of aligning cutting lines of a workplace..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed method of aligning cutting lines of a workplace... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3555146