High speed, low temperature and pressure diazo processing appara

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

354300, 34155, 34242, G03D 700

Patent

active

042550378

ABSTRACT:
A processor for developing diazo film defined by a pair of flat platens disposed within a housing and spaced apart a distance only slightly greater than the thickness of the film. The housing includes intake and outlet openings aligned with the space between the platens and means for advancing an incoming film from the intake opening, through the space between the platens and for discharging it through the outlet opening. The platen facing the emulsion side of the film is heated and includes at least one passage through which a metered amount of aqueous ammonia is passed for each film that is to be developed. The ammonia is vaporized in the passage and discharged against the emulsion side of the film. A transverse groove in the emulsion facing surface of the platen communicates with the passage to distribute the ammonia vapor over the full width of the film. The developing temperature is between about 150.degree.-200.degree. F., the ammonia vapor pressure does not substantially exceed atmospheric pressure and developing times are not more than a few seconds.

REFERENCES:
patent: 1861329 (1932-05-01), Uhlich et al.
patent: 2009962 (1935-07-01), Kurten
patent: 2667826 (1954-02-01), Martlin
patent: 2761364 (1956-09-01), Cross
patent: 3147687 (1964-09-01), Halden
patent: 3364833 (1968-01-01), Mulvany
patent: 3411906 (1968-11-01), Boone et al.
patent: 3435751 (1969-04-01), Goodman et al.
patent: 3440944 (1969-04-01), Endermann et al.
patent: 3570383 (1971-03-01), Berg
patent: 3589810 (1971-06-01), Umahashi et al.
patent: 4019193 (1977-04-01), Holman et al.
patent: 4056824 (1977-11-01), Iiyama et al.
patent: 4068249 (1978-01-01), Degenhardt et al.
patent: 4109268 (1978-08-01), Schroter et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High speed, low temperature and pressure diazo processing appara does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High speed, low temperature and pressure diazo processing appara, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed, low temperature and pressure diazo processing appara will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1291603

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.