High speed linear and rotary split-axis wire bonder

Details High speed linear and rotary split-axis wire bonder High speed linear and rotary split-axis wire bonder

2008-01-22

2008-01-22

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500

Reexamination Certificate

active

07320423

ABSTRACT:
A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.

REFERENCES:
patent: 4266710 (1981-05-01), Bilane et al.
patent: 4361261 (1982-11-01), Elles et al.
patent: 4422568 (1983-12-01), Elles et al.
patent: 4550871 (1985-11-01), Chan et al.
patent: 4792079 (1988-12-01), Bansemir
patent: 5156318 (1992-10-01), Suzuki et al.
patent: 5699951 (1997-12-01), Miyoshi
patent: 5735449 (1998-04-01), Magni
patent: 5839640 (1998-11-01), Kinnaird
patent: 5897048 (1999-04-01), Cheng et al.
patent: 5901896 (1999-05-01), Gal
patent: 5909837 (1999-06-01), Safabakhsh et al.
patent: 5931372 (1999-08-01), Miller
patent: 5979739 (1999-11-01), Jin et al.
patent: 6109501 (2000-08-01), Cheng et al.
patent: 6122307 (2000-09-01), Koseki
patent: 6126432 (2000-10-01), Okada et al.
patent: 6434726 (2002-08-01), Goossen
patent: 6460751 (2002-10-01), Thürlemann
patent: 6616030 (2003-09-01), Miller
patent: 6640423 (2003-11-01), Johnson et al.
patent: 6774651 (2004-08-01), Hembree
patent: 6913838 (2005-07-01), McCullough et al.
patent: 2002/0162875 (2002-11-01), Miller
patent: 2003/0084563 (2003-05-01), Ohkubo et al.
patent: 2005/0247758 (2005-11-01), Beatson et al.

Affiliated with

Also associated with

Rating

High speed linear and rotary split-axis wire bonder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High speed linear and rotary split-axis wire bonder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed linear and rotary split-axis wire bonder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2805149