High speed laser package

Details High speed laser package High speed laser package

1991-02-19

1993-06-22

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

333239, 257698, 257728, 257659, G02B 642, H01L 2312

Patent

active

052218600

ABSTRACT:
An optical package for use with a laser diode in high speed applications. The package comprises a metallic housing with a multilayer ceramic (MLC) insert disposed through a sidewall thereof. The MLC insert is utilized to form a microstrip transmission line of a bandwidth sufficient to couple a high frequency signal source to the laser. A number of conductive vias are disposed through the thickness of the MLC insert at the package wall to serve as electric field shorts within the insert and improve the frequency response of the microstrip. A pair of such MLC inserts may be disposed through opposing sidewalls of the package and used to provide a conventional "butterfly" configuration, while preserving the integrity of the microstrip interconnection.

REFERENCES:
patent: 4267531 (1981-05-01), Spinner et al.
patent: 4309717 (1982-01-01), Cardinal
patent: 4672151 (1987-06-01), Yamamura
patent: 4873566 (1989-10-01), Hokanson et al.
patent: 4879588 (1989-11-01), Ohtsuka et al.
patent: 4922325 (1990-05-01), Smeltz, Jr.
patent: 4930857 (1990-06-01), Acarlar
patent: 4942076 (1990-07-01), Panicker et al.
patent: 4992762 (1991-02-01), Godshalt et al.

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