High speed jet soldering system

Details High speed jet soldering system High speed jet soldering system

1996-01-05

1999-08-17

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228262, 228254, 228256, 347 68, B23K 300

Patent

active

059381027

ABSTRACT:
Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

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Declaration of Robert J. Balag.
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