High speed high power nitride semiconductor device

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C257S194000

Reexamination Certificate

active

07955984

ABSTRACT:
A nitride semiconductor device has: a substrate; a semiconductor lamination formed on the substrate, and including a channel layer of nitride semiconductor; source and drain electrodes formed on the semiconductor lamination in ohmic contact with the channel layer; an insulating layer formed on the semiconductor lamination, and having an opening in a gate electrode contact area, a total thickness portion having a flat surface and a total thickness in an area spaced apart from the opening, and a transient portion with monotonically changing thickness between the opening and the total thickness portion, a sidewall of the insulating layer facing the opening rising steeply to a partial thickness of the total thickness; and a T-shaped gate electrode contacting the semiconductor lamination layer in the opening and extending on the insulating film to portions with increased thickness thicker than the partial thickness.

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Office Action dated Aug. 17, 2009 in counterpart Korean patent application No. 10-2007-0120043 with English translation.
Seoul National University Master's Thesis p. 1-1.

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