Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-04-04
2006-04-04
Zarroli, Michael C. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S092000, C439S095000
Reexamination Certificate
active
07021945
ABSTRACT:
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
REFERENCES:
patent: 3904265 (1975-09-01), Hollyday et al.
patent: 4239318 (1980-12-01), Schwartz
patent: 4433886 (1984-02-01), Cassarly et al.
patent: 4449778 (1984-05-01), Lane
patent: 4718866 (1988-01-01), Yamaguchi
patent: 4789357 (1988-12-01), Yamaguchi et al.
patent: 4808126 (1989-02-01), Wilson
patent: 4898546 (1990-02-01), Elco et al.
patent: 4909743 (1990-03-01), Johnson et al.
patent: 4938704 (1990-07-01), Fujiura
patent: 5055069 (1991-10-01), Townsend et al.
patent: 5133679 (1992-07-01), Fusselman et al.
patent: 5135405 (1992-08-01), Fusselman et al.
patent: 5256086 (1993-10-01), Ponn
patent: 5282268 (1994-01-01), Mieras et al.
patent: 5310354 (1994-05-01), Oswald, Jr.
patent: 5331505 (1994-07-01), Wilheim
patent: 5360349 (1994-11-01), Provencher et al.
patent: 5403206 (1995-04-01), McNamara et al.
patent: 5409400 (1995-04-01), Davis
patent: 5588851 (1996-12-01), Morlion et al.
patent: 5607326 (1997-03-01), McNamara et al.
patent: 5672064 (1997-09-01), Provencher et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5748449 (1998-05-01), Tahmassebpur
patent: 5795191 (1998-08-01), Preputnick et al.
patent: 5969944 (1999-10-01), Borkar et al.
patent: 5993259 (1999-11-01), Stokoe et al.
patent: 5997361 (1999-12-01), Driscoll et al.
patent: 6206729 (2001-03-01), Bradley et al.
patent: 6213787 (2001-04-01), Murphy
patent: 6234827 (2001-05-01), Nishio et al.
patent: 6281715 (2001-08-01), DeClue et al.
patent: 6290535 (2001-09-01), Lin et al.
patent: 6293827 (2001-09-01), Stokoe
patent: 6554647 (2003-04-01), Cohen et al.
patent: 6628524 (2003-09-01), Washino et al.
patent: 6635958 (2003-10-01), Bates et al.
patent: 6739885 (2004-05-01), Ward et al.
patent: 6776629 (2004-08-01), Shuey
Douglass Brooks, “Differential Impedance: What's the Difference?”Printed Circuit Design. Aug., 1998, Atlanta, U.S.A.
National Semiconductor,LVDS Owners Manual: A General Guide for National's Low Voltage Differential Signalling(Lvds)and Bus LVDS Products. 2nded. Spring, 2000.
Product Catalogue of D Range Connectors by ITW McMurdo Connectors (6 pages).
Product Catalogue of D Subminiature Connectors by ITT Cannon (300 pages).
Eastman Gary D.
Langon Alfred J.
Perugini Michael N.
Prew Raymond A.
Saydam Erol D.
Advanced Interconnection Corporation
Zarroli Michael C.
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