High speed high density connector for electronic signals

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge

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439 67, H01R 909

Patent

active

057047936

ABSTRACT:
A connector for printed circuit boards. Electrical connections are made between two printed boards through flex circuits which have contact pads pressed against contact pads on each of the printed circuit boards. Sufficient, uniform pressure is maintained on the contacts through the use of compressible tubes behind the contact pads on the flex circuits. The compressible tubes are spring biased towards the flex circuits. When a circuit board is engaged in the connector, it compresses the compressible tube and the spring biasing mechanism, thereby generating sufficient contact force. The connector is easy to manufacture in a variety of sizes because its pieces are modular. Many of the pieces are of uniform cross section, facilitating use of low cost extrusion operations. An embodiment is disclosed in which one printed circuit board is pivoted into contact with the contact pads.

REFERENCES:
patent: 3609463 (1971-09-01), Laboue
patent: 4636019 (1987-01-01), Gillett et al.
patent: 4911653 (1990-03-01), Walton et al.
patent: 4934942 (1990-06-01), Casciotti et al.
patent: 4968265 (1990-11-01), Fox, Jr.
patent: 5002496 (1991-03-01), Fox, Jr.
patent: 5123852 (1992-06-01), Gillett
patent: 5156553 (1992-10-01), Katsumata et al.
patent: 5171154 (1992-12-01), Casciotti et al.
patent: 5368491 (1994-11-01), Locati
patent: 5378161 (1995-01-01), Loder
patent: 5505626 (1996-04-01), Grabbe et al.
A High Density, Flex Circuit Based, Pressure Interconnect System For High Speed Backplane Applications, David McNamara No Date.
A Modular Surface Mount-Compatible Interconnection System For High Speed Applications Gandhi et al. No Date.
Teradyne Schematic DVO-2990-000 No Date.
High Density Field REplaceable Flexible Circuit Connector. Campbell and Howe. IBM Technical Disclosure Bulletin 1991 No Month.
High-performance connectors enter system spotlight. Caruthers. Computer Design 1993 No Month.

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