High speed high density connector electronic signals

Electrical connectors – With coupling movement-actuating means or retaining means in... – Coupling part for receiving edge of planar board moving...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

439 67, H01R 1362

Patent

active

058203974

ABSTRACT:
A connector for printed circuit boards. Electrical connections are made between two printed boards through flex circuits which have contact pads pressed against contact pads on each of the printed circuit boards. Sufficient, uniform pressure is maintained on the contacts through the use of compressible tubes behind the contact pads on the flex circuits. The compressible tubes are spring biased towards the flex circuits. When a circuit board is engaged in the connector, it compresses the compressible tube and the spring biasing mechanism, thereby generating sufficient contact force. The connector is easy to manufacture in a variety of sizes because its pieces are modular. Many of the pieces are of uniform cross section, facilitating use of low cost extrusion operations. An embodiment is disclosed in which one printed circuit board is pivoted into contact with the contact pads.

REFERENCES:
patent: 3701071 (1972-10-01), Landman
patent: 4678252 (1987-07-01), Moore
patent: 4689721 (1987-08-01), Damerow et al.
patent: 4911653 (1990-03-01), Walton et al.
patent: 5002496 (1991-03-01), Fox
patent: 5308249 (1994-05-01), Renn et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High speed high density connector electronic signals does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High speed high density connector electronic signals, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed high density connector electronic signals will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-307847

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.