Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1991-01-24
1992-05-12
Thompson, Gregory D.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
361386, 361400, H05K 720
Patent
active
051133148
ABSTRACT:
An electronic component assembly and method for enhancing density and operational speed. The assembly includes a plurality of integrated circuit chips which are mounted to a planar surface of a substrate, preferably a printed circuit board, with the opposed major faces of the chips being perpendicular to the planar surface. One of the major faces of each chip is the active face having a pattern of signal pads. The pads are disposed along the face periphery adjacent to the edge of the chip contacting the printed circuit board. The signal pads have solder bumps which can be soldered directly to contact pads on the printed circuit board. A passivating edge-coating on each chip protects the chip and prevents electrical shorting on the printed circuit board. A source of fluid directs a cooling flow along the large area major surfaces of the chips.
REFERENCES:
patent: 3515949 (1970-06-01), Michaels et al.
patent: 3899719 (1975-08-01), Murphy
patent: 4059849 (1977-11-01), Mitchell
patent: 4266282 (1981-05-01), Henle et al.
patent: 4399485 (1983-08-01), Wright et al.
patent: 4499524 (1985-02-01), Shioleno
patent: 4507710 (1985-03-01), Jung
patent: 4689719 (1987-08-01), Prussas et al.
patent: 4730238 (1988-03-01), Cook
patent: 4743868 (1988-05-01), Katoh et al.
patent: 4785533 (1988-11-01), Seino et al.
patent: 4807087 (1989-02-01), Sawaya
patent: 4894751 (1990-01-01), Wehnelt
patent: 4922378 (1990-05-01), Malhi et al.
patent: 5050039 (1991-09-01), Edfors
Michael Leibowitz; "The Computer Speed Barrier," Technology Review, Aug./Sep. 1990 pp. 14-15.
Nagesh Voddarahalli K.
Wheeler Richard L.
Hewlett--Packard Company
Thompson Gregory D.
LandOfFree
High-speed, high-density chip mounting does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High-speed, high-density chip mounting, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-speed, high-density chip mounting will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2427278