High speed electronics interconnect and method of manufacture

Details High speed electronics interconnect and method of manufacture High speed electronics interconnect and method of manufacture

2008-05-13

2008-05-13

Schillinger, Laura M. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S664000, C257S208000

Reexamination Certificate

active

10793576

ABSTRACT:
Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects and also reduce the signal propagation delay, respectively. Ideally, the speed of the electrical signal on the signal line can be reached to speed of the light in the air, and the bandwidth can be reached to closer to the optical fiber. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground plan. The signal line proposed in this invention could be made any type of signal line configuration for example, microstripline, strip line or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. The interconnect system based on the fundamental techniques provided in this invention, can be used for on-chip interconnects where the high speed electronics devices are connected by the signal line laid on the oxide or dielectric material. Again, the interconnect system based on the fundamental techniques provided in this invention, can also be used for off-chip interconnects (chip-to-chip interconnects), where the whole portion or portion of the PCB on which high speed chips are to be connected, are having the dielectric system with opened trench or slot to reduce the microwave loss. High scale chip-to-chip interconnection using of the multilayered PCB is possible. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. The main advantages of this invention are to make high speed interconnects systems for on-chip and off-chip interconnects. More over, this fundamental technology is also used for the high sped die package, high speed connector, and high speed cables where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects.

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