High speed electrical signal interconnect structure

Details High speed electrical signal interconnect structure High speed electrical signal interconnect structure

1991-11-21

1993-11-09

LaRoche, Eugene R.

Static information storage and retrieval

Interconnection arrangements

439326, 371 111, 361684, 361783, H01R 1300, H05K 720, G11C 1300, G11C 500

Patent

active

052608921

ABSTRACT:
An improved high speed, high density Dynamic Random Access Memory (DRAM) electrical signal interconnect structure which has particular application to computer systems which employ Single In-line Memory Modules (SIMMs). The structure contains an on-board buffer for driving time critical signals from a single source and further includes innovative signal trace routing having approximately equivalent minimum distance signal line lengths and vias to memory modules on the front and back surfaces of the circuit board resulting in a high speed, high density SIMM with clean rising/falling signal edges.

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IBM Technical Disclosure Bulletin, vol. 21, No. 2, Jul. 1978, in Armonk, New York, U.S., pp. 585-586, Author: Doo, et al., Entitled: High Performance Package For Memory.

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