High speed copper electroplating process and bath therefor

Details High speed copper electroplating process and bath therefor High speed copper electroplating process and bath therefor

1984-05-29

1985-11-26

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

045553157

ABSTRACT:
An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed copper plating employing average cathode current densities substantially higher than heretofore feasible. The electrolyte contains an additive system comprising carefully controlled relative concentrations of:

REFERENCES:
patent: 3770598 (1973-11-01), Creutz
patent: 4336114 (1982-06-01), Mayer et al.

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