High-speed chip-to-chip communication interface

Pulse or digital communications – Pulse transmission via radiated baseband

Reexamination Certificate

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Details

C375S257000, C375S259000, C375S295000, C375S316000

Reexamination Certificate

active

10439571

ABSTRACT:
A high-speed parallel interface for communicating data between integrated circuits is disclosed. The interface is implemented by a transmitter and receiver pair and a single-ended parallel interconnect bus coupling to the transmitter and receiver pair. As opposed to transmitting small swing signals over differential signal lines, the transmitter transmits data to the receiver at full swing over the single-ended parallel interconnect bus. The invention can be implemented with simple CMOS circuitry that does not consume large die area. Accordingly, many link interfaces can be implemented on a single chip to provide a large data bandwidth.

REFERENCES:
patent: 5268937 (1993-12-01), Marbot
patent: 5625563 (1997-04-01), Rostoker et al.
patent: 5687326 (1997-11-01), Robinson
patent: 6493351 (2002-12-01), Shideler
patent: 6493394 (2002-12-01), Tamura et al.
patent: 6522188 (2003-02-01), Poole
patent: 6625163 (2003-09-01), Shideler et al.
patent: 6684350 (2004-01-01), Theodoras et al.
patent: 6845461 (2005-01-01), Kim
patent: 6965299 (2005-11-01), Dally et al.
patent: 2002/0073255 (2002-06-01), Davidson et al.

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