Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1996-02-09
1997-07-08
Heinrich, Samuel M.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228 8, 228 11, 2281101, H01L 21607
Patent
active
056452101
ABSTRACT:
There is provided an ultrasonic generator of the type having a power amplifier. The output of the power amplifier is connected across and through an ultrasonic transducer which holds a bonding tool to be engaged on a bonding target. A current sufficient to induce a resonant frequency is applied across the ultrasonic transducer in air and before touch down on the bonding target while continuously monitoring the current and voltage across the transducer. A touch down detector circuit is coupled to the current and voltage being monitored and initiates a touch down signal which is employed to control these Z-axis drive motor of an automatic wire bonder within several microseconds of the actual touch down time.
REFERENCES:
patent: 4824005 (1989-04-01), Smith, Jr.
patent: 5046654 (1991-09-01), Yamazaki et al.
patent: 5357423 (1994-10-01), Weaver et al.
patent: 5386936 (1995-02-01), Mochida et al.
patent: 5494207 (1996-02-01), Asanasavest
Guez Avner
Toner Eugene Michael
Heinrich Samuel M.
Kulicke and Soffa Investments, Inc.
Sowell John B.
LandOfFree
High speed bonding tool contact detector does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High speed bonding tool contact detector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed bonding tool contact detector will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2405060