High sensitivity resist system for lift-off metallization

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 44, 427273, 96 351, 96 362, 96115R, B05D 306

Patent

active

040242935

ABSTRACT:
High sensitivity resist films for lift-off metallization are formed by coating a substrate with at least two layers of polymeric materials, each layer of which is developed by different developers that are mutual exclusive of one another. The resist can operate for lift-off at electron beam exposure equal to or greater than 5.times.10.sup.-.sup.6 coulombs/cm.sup.2.

REFERENCES:
patent: 3799777 (1974-03-01), O'Keefe et al.
patent: 3930857 (1976-01-01), Bendz et al.
patent: 3934057 (1976-01-01), Moreau et al.
Chiv et al., "IBM Tech. Disc. Bull., July 1975, vol. 18, No. 2, p. 395.

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