High sensitivity positive resist layers and mask formation proce

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

96 351, 96 362, 20415914, 427273, 427352, 428520, 428901, B05D 306

Patent

active

039340570

ABSTRACT:
A high sensitivity resist layer structure for high energy radiation exposure is formed by coating plural layers of radiation degradable polymers on a substrate which layers are successively slower dissolving in the resist developer. Upon exposure and solvent development, a resist edge profile is obtained which is particularly useful for metal lift-off.

REFERENCES:
patent: 2964401 (1960-12-01), Plambeck
patent: 2993789 (1961-07-01), Crawford
patent: 3535137 (1970-10-01), Haller et al.
patent: 3799777 (1974-03-01), O'Keefe

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