High resolution lithography system for microelectronic fabricati

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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430296, 430291, 430315, 430317, 430323, 430328, 430394, 430942, 427 38, 427 431, B05D 306, G03C 500

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043213170

ABSTRACT:
Master and working photomasks are made using a photoresist darkened on and bonded to respective quartz substrates. The working photomask is formed by deep ultraviolet light exposure through an electron beam patterned master mask. Deep ultraviolet light is also used to pattern a resist on a silicon slice through the working mask. The same resist is preferably used on the slice and both masks.

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Okuyama et al., "High Dose Ion Implantation into Photoresist", Journal of Electrochemical Society, v. 125, n 8, pp. 1293-1298, 8/78.
Oldham, "The Fabrication of Microelectronic Circuits", Scientific American, v. 237, n 3, pp. 111-114, 119-124, 126, 128, 9/77.
LeBoss, "Deep UV Option Promotes Fine Lines", Electronics, pp. 44-46, 9/79.

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