High reliability thick film surface mount fuse assembly

Details High reliability thick film surface mount fuse assembly High reliability thick film surface mount fuse assembly

1993-12-29

1995-09-26

Donovan, Lincoln

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

Fusible element actuated

337297, 29623, H01H 8504

Patent

active

054537266

ABSTRACT:
A thick film surface mountable fuse assembly for high reliability applications. In the first embodiment the fuse assembly consists of an insulative substrate on which a single low mass thick film fusible elements is disposed. The substrate utilized is a thermally and electrically insulative ceramic. Thick film contact pads permit the attachment of end-caps which are in electrical contact with the fusible element. The fusible element is covered with a coating of low temperature melting arc suppressant glass. The arc suppressant glass is substantially devoid of air thus reducing the risk of a catastrophic failure of the fuse. In a second embodiment of the fuse assembly, the thermally insulated substrate and thick film components are housed in a insert molded housing. In a third embodiment of the fuse assembly, solder bumps are deposited on the thick film contact pads, forming a flip chip package.

REFERENCES:
patent: 4873506 (1989-10-01), Gurevich
patent: 5296833 (1994-03-01), Breen et al.

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