High-reliability plastic-packaged semiconductor device

Details High-reliability plastic-packaged semiconductor device High-reliability plastic-packaged semiconductor device

1975-05-23

1977-01-04

James, Andrew J.

357 71, 357 72, 357 73, H01L 2934, H01L 2348, H01L 2328, H01L 2330

Patent

active

040018725

ABSTRACT:
A plastic-packaged semiconductor device includes a semiconductor chip with a hermetic passivation and metallization system, including silicon nitride passivation and noble metal interconnection conductors. The device is highly resistant to degradation in the presence of water vapor and corrosive atmospheres.

REFERENCES:
patent: 3465209 (1969-09-01), Denning et al.
patent: 3729406 (1973-04-01), Osborne et al.
patent: 3751292 (1973-08-01), Kongable
patent: 3760242 (1973-09-01), Duffy et al.
patent: 3833919 (1974-09-01), Naber
patent: 3871018 (1975-03-01), Jackson et al.
patent: 3913127 (1975-10-01), Suzuki et al.

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