High reliability electrical components

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29621, 427 96, 427 97, 427102, 427103, H01C 1706

Patent

active

045547327

ABSTRACT:
An array of electrically interconnected spaced electrical components on an apertured substrate wafer, each component being connected to terminal conductor pads on one surface of the substrate and to terminal conductor pads on the opposite surface of the substrate by thick film conductor strips which extend along the walls of the apertures is disclosed.

REFERENCES:
patent: 4199745 (1980-04-01), Barry
patent: 4278706 (1981-07-01), Barry
patent: 4294648 (1981-10-01), Brede

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