High rate sputtering system and method

Details High rate sputtering system and method High rate sputtering system and method

1983-07-11

1984-02-28

Demers, Arthur P.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204298, C23C 1500

Patent

active

044340370

ABSTRACT:
A high rate sputtering device and method provide an extended life moveable cathode/target allowing increased current density. The cathode/target may be provided as a moving ribbon or rotating drum or disk, passing through the active plasma while the cooling of the cathode/target is improved. Alternatively, the cathode/target may be formed as a rod fed into the active plasma.

REFERENCES:
patent: 3775285 (1973-11-01), Lane
patent: 3884787 (1975-05-01), Kuehnle
patent: 3898952 (1975-08-01), Shirahata
patent: 4013539 (1977-03-01), Kuehnle
patent: 4116791 (1978-09-01), Zega
patent: 4137142 (1979-01-01), Vertegaal
patent: 4261808 (1981-04-01), Walter et al.
patent: 4322276 (1982-03-01), Meckel et al.

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