High-rate polishing method

Details High-rate polishing method High-rate polishing method

2008-12-23

2011-11-15

Rose, Robert (Department: 3727)

Abrading

Abrading process

Glass or stone abrading

C451S527000

Reexamination Certificate

active

08057282

ABSTRACT:
The invention provides a method for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The substrate is fixed within a carrier fixture having a channel-free surface. The method comprises securing the substrate in the carrier fixture with the channel-free surface adjacent and parallel to a polishing surface of the polishing pad. The polishing pad has multiple grooves with high-rate paths. The method includes applying polishing medium to the polishing pad adjacent the carrier fixture; and rotating the polishing pad and carrier fixture to polish the substrate with the polishing pad and the polishing medium wherein the channel-free surface of the carrier fixture presses against the polishing pad to impede flow of the polishing medium into the substrate and the high-rate groove paths traverse the carrier fixture to promote flow of the polishing medium to the substrate.

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patent: 2008/0182489 (2008-07-01), Muldowney
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