High rate method for stable temperature control of a substrate

Electric heating – Heating devices – With power supply and voltage or current regulation or...

Reexamination Certificate

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C219S121430, C118S725000, C392S418000

Reexamination Certificate

active

08084720

ABSTRACT:
A method for multi-step temperature control of a substrate includes selecting a first set-point temperature and a second set-point temperature for the substrate, and selecting a first PID parameter set including a first proportional constant KP1, a first integral constant KI1and a first derivative constant KD1, and selecting a second PID parameter set including a second proportional constant KP2, a second integral constant KI2and a second derivative constant KD2. The substrate is placed on a substrate holder, the temperature of the substrate is adjusted to the first set-point temperature and the substrate is processed for a first period of time at the first set-point temperature. The temperature of a region of the substrate is changed from the first set-point temperature to the second set-point temperature using the first PID parameter set for a first ramp period of time and using the second PID parameter set for a second ramp period of time, the second ramp period of time following the first ramp period of time. The substrate is then processed for a second period of time at the second set-point temperature.

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patent: 2000-269189 (2000-09-01), None

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