High-rate groove pattern

Details High-rate groove pattern High-rate groove pattern

2008-12-23

2011-11-22

Rose, Robert (Department: 3727)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S041000, C451S530000, C451S921000

Reexamination Certificate

active

08062103

ABSTRACT:
The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The polishing pad comprises a center, an inner region surrounding the center, a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with a high-rate path. The transition region is adjacent the outer region and within a radius from the center defined as follows:rTR=0.7⁢r*⁢⁢to⁢⁢1.3⁢r*wherer*=RC⁢(RRC)2-cos⁡(2⁢θc⁢⁢0)-sin⁡(2⁢θc⁢⁢0)⁢(R/RCcos⁢⁢θc⁢⁢0)2-1;with the inner region originating continuous grooves that extend uninterrupted to the outer region.

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