High-rate electroless deposition process

Details High-rate electroless deposition process High-rate electroless deposition process

1984-11-19

1986-06-10

Hoffman, James R.

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427438, B05D 118

Patent

active

045942730

ABSTRACT:
The rate of deposition of metallic film on a substrate in an electroless plating process is substantially increased without affecting film properties or causing adverse consequences to the plating bath. The boiling point of the plating bath is elevated either by adding to the bath a substance, such as ethylene glycol, which does not alter the reactivity of the bath, or by providing a sealed enclosure over the bath to increase the ambient pressure. The bath is then heated to a substantially higher temperature but below the temperature at which localized boiling occurs. Excellent metal film qualities are obtained on the substrate at a substantially higher rate than in conventional electroless plating and no nucleation sites are created in the bath to cause spontaneous decomposition of the bath.

REFERENCES:
patent: 3158500 (1964-11-01), Sallo et al.

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