High purity titanium sputtering target and method of making

Details High purity titanium sputtering target and method of making High purity titanium sputtering target and method of making

1997-08-14

2000-04-04

Sheehan, John

Metal treatment

Process of modifying or maintaining internal physical...

Heating or cooling of solid metal

C22F 118

Patent

active

060456345

ABSTRACT:
A high purity titanium polycrystalline target with uniform grain size and near ideal (103) crystallographic orientation and a method of making. Uniform grain size from 10 .mu.m-500 .mu.m is achieved by using a fine grain five inch diameter titanium billet produced by hot working an electron beam cast billet. Greater than 80% (103) crystallographic orientation is achieved while maintaining uniform and optimal grain size in the target. The result is a higher collimated deposition rate with increased efficiency of bottom coverage of vias and a highly (002) oriented titanium film.

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