High profile shrink package

Package making – Methods – With contents treating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

53442, 53449, 53453, 426124, 426129, 426396, B65B 1152, B65B 1158, B65B 3102, B65B 5302

Patent

active

049584804

ABSTRACT:
The present invention involves a method of packaging a product including drawing a thermoplastic thermoformable web into a thermoforming mold to form a cavity, inserting the product into the cavity, moving the web and product to a vacuum chamber, placing a tray, upside down, in the chamber on top of the web to define an unsealed package; sealing the tray to the web under vacuum; and shrinking the bottom web.

REFERENCES:
patent: 2621129 (1952-12-01), Ramsbottom et al.
patent: 3387427 (1968-06-01), Perdue
patent: 3674626 (1972-07-01), Mergy
patent: 4034536 (1977-07-01), Mahaffy et al.
patent: 4611456 (1986-09-01), Gillio-tos et al.
patent: 4642239 (1987-02-01), Ferrar et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High profile shrink package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High profile shrink package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High profile shrink package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-323205

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.