High pressure water stream to separate a multi-layer integrated

Details High pressure water stream to separate a multi-layer integrated High pressure water stream to separate a multi-layer integrated

1998-11-24

2000-09-19

Monin, Jr., Donald L.

Metal working

Method of mechanical manufacture

Disassembling

294264, 294265, 29762, 438 4, 438 15, 438460, H01L 2144

Patent

active

061193259

ABSTRACT:
Aspects for device and package separation of a multi-layer integrated circuit device attached at a frontside to an integrated circuit package are described. In an exemplary method aspect, the method includes slicing through material coupling the multi-layer integrated circuit to the integrated circuit package with a high power water stream. The slicing further includes cutting through solder bump material. Additionally, the multi-layer integrated circuit device is utilized for device analysis from a frontside following separation from the integrated circuit package by the step of slicing.

REFERENCES:
patent: 5206181 (1993-04-01), Gross
patent: 5480503 (1996-01-01), Casey et al.
patent: 5888884 (1999-03-01), Wojnarowski
patent: 5895230 (1999-04-01), Bartley
patent: 5904489 (1999-05-01), Khosropour et al.
patent: 5919713 (1999-07-01), Ishii et al.
patent: 5930599 (1999-07-01), Fujimoto et al.
patent: 5989474 (1999-11-01), Suzuki

Affiliated with

Also associated with

Rating

High pressure water stream to separate a multi-layer integrated does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High pressure water stream to separate a multi-layer integrated , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High pressure water stream to separate a multi-layer integrated will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1059554