High pressure processing apparatus and method

Details High pressure processing apparatus and method High pressure processing apparatus and method

2006-09-26

2006-09-26

Perrin, Joseph L. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S103100, C134S186000, C134S902000

Reexamination Certificate

active

07111630

ABSTRACT:
When the hatch of a substrate washing chamber5is opened to receive a substrate, certain valves are closed, and a valve is opened, supply CO2to purge the substrate washing chamber5to and exclude air. When the hatch is closed, another valve is opened to vent substrate washing chamber5so that the CO2expels any gas and unwanted air from the substrate washing chamber5and the conduits. Thereafter, super critical CO2is used to wash the substrate and clean the circulation line. The flow of supercritical CO2is sent to the substrate washing chamber5. After flowing through the circulation line, including a circulation channel11, it passes through a bypass channel12to a decompressor7. Any chemicals or organic substances left in the circulation line are continuously sent to a separation/recover bath8together with the flow.

REFERENCES:
patent: 5355901 (1994-10-01), Mielnik et al.
patent: 5526834 (1996-06-01), Mielnik et al.
patent: 6092538 (2000-07-01), Arai et al.
patent: 6442980 (2002-09-01), Preston et al.
patent: 6619304 (2003-09-01), Worm
patent: 2001/0050096 (2001-12-01), Constantini et al.
patent: 05-226311 (1993-09-01), None
patent: 08-100197 (1996-04-01), None
patent: 10-094767 (1998-04-01), None
patent: 10-163152 (1998-06-01), None
patent: 2000-308862 (2000-11-01), None
patent: 1999-63626 (1999-07-01), None

Affiliated with

Also associated with

Rating

High pressure processing apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High pressure processing apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High pressure processing apparatus and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3602252