High pressure magnetron cathode assembly and sputtering apparatu

Details High pressure magnetron cathode assembly and sputtering apparatu High pressure magnetron cathode assembly and sputtering apparatu

1998-08-10

2000-08-29

McDonald, Rodney

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429807, 20429809, 20429812, 20429819, 20419224, 20429814, 20429806, 20429813, C23C 1434

Patent

active

061103365

ABSTRACT:
A magnetron cathode and sputtering system in which the cathode assembly includes a diaphragm arrangement with one or more diaphragms which overlie at least the edge of the cathode at the dark side region of the gas discharge so that plasmas cannot form between the diaphragm and target. An improved sputtering is thereby obtained in a high pressure mode of operation.

REFERENCES:
patent: 3361659 (1968-01-01), Bertelsen
patent: 4508612 (1985-04-01), Blackwell et al.
patent: 4776938 (1988-10-01), Abe et al.
patent: 4933063 (1990-06-01), Katsura et al.
patent: 5328585 (1994-07-01), Stevenson et al.
patent: 5427665 (1995-06-01), Hartig et al.
patent: 5514259 (1996-05-01), Shiota et al.
patent: 5667650 (1997-09-01), Face et al.

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