High pressure header for a semiconductor pressure transducer

Details High pressure header for a semiconductor pressure transducer High pressure header for a semiconductor pressure transducer

1998-12-17

2000-07-18

Reichard, Dean A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257708, H01L 2302

Patent

active

060910224

ABSTRACT:
A header structure for a semiconductor pressure transducer includes a cylindrical glass member located within a tubular housing having a closed end. A tubular core member extends through a central axial hole in the glass member. The core member has a sealed end proximate the closed end of the housing and an opposite end. A plurality of electrically conductive terminal pins extend through the glass member in surrounding relation to the core member and exit the housing through a plurality of holes in the closed end. A semiconductor die is mounted adjacent the opposite end of the core member and is electrically connected to the surrounding terminal pins by wire leads.

REFERENCES:
patent: 3817107 (1974-06-01), Shimada et al.
patent: 4040297 (1977-08-01), Karsmakers et al.
patent: 4063057 (1977-12-01), Meisenheimer, Jr.
patent: 4088381 (1978-05-01), Harnett
patent: 4486622 (1984-12-01), Dathe et al.
patent: 4746893 (1988-05-01), Shak
patent: 4764747 (1988-08-01), Kurtz et al.
patent: 5522267 (1996-06-01), Lewis

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