Valves and valve actuation – Electrically actuated valve
Reexamination Certificate
2000-06-27
2003-01-14
Yuen, Henry C. (Department: 3625)
Valves and valve actuation
Electrically actuated valve
C251S366000, C251S367000, C251S369000
Reexamination Certificate
active
06505811
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates in general to fluid control valve assemblies for high-pressure fluid circuits such as vehicle brake systems, and in particular to high-pressure fluid control valve assemblies having a microvalve device attached via a high-pressure fluid connection to a fluid distributing substrate.
MicroElectroMechanical Systems (MEMS) is a class of systems that are physically small, having features with sizes in the micrometer range. These systems have both electrical and mechanical components. The term “micromachining” is commonly understood to mean the production of three-dimensional structures and moving parts of MEMS devices. MEMS originally used modified integrated circuit (computer chip) fabrication techniques (such as chemical etching) and materials (such as silicon semiconductor material) to micromachine these very small mechanical devices. Today there are many more micromachining techniques and materials available. The term “microvalve device” as used in this application means a complete, functioning valve having features with sizes in the micrometer range, and thus is by definition at least partially formed by micromachining. Furthermore, a “microvalve device”, as used in this application includes a microvalve, and may include other components such as pressure, temperature, flow or other types of sensors, pumps or other valves of various types. It should be noted that if components other than a microvalve are included in the microvalve device, these other components may be micromachined components or standard sized (larger) components.
Various microvalve devices have been proposed for controlling fluid flow within a fluid circuit. A typical microvalve device includes a displaceable member or valve movably supported by a body. Depending on the type of valve, the valve may be operatively coupled to an actuator for movement between a closed position and a fully open position. When placed in the closed position, the valve blocks or closes a first fluid port that is placed in fluid communication with a second fluid port, thereby preventing fluid from flowing between the fluid ports. When the valve moves from the closed position to the fully open position, fluid is increasingly allowed to flow between the fluid ports.
SUMMARY OF THE INVENTION
The invention relates to a fluid control valve assembly including a microvalve for controlling fluid flow in a fluid circuit having a relatively high fluid pressure requirement, such as vehicular brake system, is fixed to an associated fluid distributing substrate with a high-pressure fluid connection. The fluid distributing substrate is provided with fluid passages adapted for connection to a fluid source to provide communication between the fluid source and the microvalve device. The connection between the microvalve and the fluid distributing substrate may include metallic connections forming electrical current paths between the microvalve and the substrate; solder joints forming part of the pressure boundary of the high-pressure fluid connection; underfill formed of elastomeric or other adhesive; and bonding between the substrate and the microvalves in only selected portions of the surface of the microvalve.
Various other objects and advantages of this invention will become apparent to those skilled in the art from the following detailed description of the preferred embodiments, when read in light of the accompanying drawings.
REFERENCES:
patent: 3031747 (1962-05-01), Green
patent: 3729807 (1973-05-01), Fujiwara
patent: 3860949 (1975-01-01), Stoeckert et al.
patent: 4005454 (1977-01-01), Froloff et al.
patent: 4019388 (1977-04-01), Hall, II et al.
patent: 4023725 (1977-05-01), Ivett et al.
patent: 4152540 (1979-05-01), Duncan et al.
patent: 4181249 (1980-01-01), Peterson et al.
patent: 4341816 (1982-07-01), Lauterbach et al.
patent: 4434813 (1984-03-01), Mon
patent: 4581624 (1986-04-01), O'Connor
patent: 4647013 (1987-03-01), Giachino et al.
patent: 4661835 (1987-04-01), Gademann et al.
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4821997 (1989-04-01), Zdeblick
patent: 4824073 (1989-04-01), Zdeblick
patent: 4869282 (1989-09-01), Sittler et al.
patent: 4891120 (1990-01-01), Sethi et al.
patent: 4943032 (1990-07-01), Zdeblick
patent: 4959581 (1990-09-01), Dantlgraber
patent: 4966646 (1990-10-01), Zdeblick
patent: 5029805 (1991-07-01), Albarda et al.
patent: 5037778 (1991-08-01), Stark et al.
patent: 5054522 (1991-10-01), Kowanz et al.
patent: 5074629 (1991-12-01), Zdeblick
patent: 5096643 (1992-03-01), Kowanz et al.
patent: 5131729 (1992-07-01), Wetzel
patent: 5133379 (1992-07-01), Jacobsen et al.
patent: 5142781 (1992-09-01), Mettner et al.
patent: 5161774 (1992-11-01), Engelsdorf et al.
patent: 5178190 (1993-01-01), Mettner
patent: 5215244 (1993-06-01), Buchholz et al.
patent: 5216273 (1993-06-01), Doering et al.
patent: 5217283 (1993-06-01), Watanabe
patent: 5238223 (1993-08-01), Mettner et al.
patent: 5267589 (1993-12-01), Watanabe
patent: 5271431 (1993-12-01), Mettner et al.
patent: 5309943 (1994-05-01), Stevenson et al.
patent: 5375919 (1994-12-01), Furuhashi
patent: 5400824 (1995-03-01), Gschwendtner et al.
patent: 5445185 (1995-08-01), Watanabe et al.
patent: 5454906 (1995-10-01), Baker et al.
patent: 5458405 (1995-10-01), Watanabe
patent: 5460908 (1995-10-01), Reinberg
patent: 5553790 (1996-09-01), Findler et al.
patent: 5566703 (1996-10-01), Watanabe et al.
patent: 5909078 (1999-06-01), Wood et al.
patent: 5926955 (1999-07-01), Kober
patent: 5941608 (1999-08-01), Campau et al.
patent: 6019437 (2000-02-01), Barron et al.
patent: 6116863 (2000-09-01), Ahn et al.
patent: 6168395 (2001-01-01), Quenzer et al.
patent: 6184065 (2001-02-01), Smith et al.
patent: 6213789 (2001-04-01), Chua et al.
patent: 2215526 (1973-10-01), None
patent: 2930779 (1980-02-01), None
patent: 3401404 (1985-07-01), None
patent: 2238267 (1991-05-01), None
IEEE Technical Digest entitled “Compliant Electro-thermal Microactuators”, J. Jonsmann, O. Sigmund, S. Bouwstra, Twelfth IEEE International Conference on Micro Electro Mechanical Systems held Jan. 17-21, 1999, Orlando, Florida, pp. 588-593, IEEE Catalog No.: 99CH36291C.
“A Silicon Microvalve For The Proportional Control Of Fluids” by K.R. Williams, N.I. Maluf, E.N. Fuller, R.J. Barron, D.P. Jaeggi, and B.P. van Drieënhuizen, Transducers '99, Proc. 10thInternational Conference on Solid State Sensors and Actuators, held Jun. 7-10, 1999, Sendai, Japan, pp. 18-21.
Mark M. Konarski, “Cure Parameter Effects On The Tgand CTE Of Flip Encapsulants,” 43rdInternational SAMPE Symposium and Exhibition. Materials and Process Affordability. Keys to the Future. Held May 31 to Jun. 4, 1998, Anaheim, CA, pp. 823-832 vol. 1. Copyright 1999, IEE.
Jing, Qi, R. Wayne Johnson, Erin Yaeger, Mark Konarski, and Larry Crane, “Flip Chip on Laminate Manufacturability,” Proc. SPEI—Int. Soc. Opt. Eng. (USA) 1999 International Conference on High Density Packaging and MCMs. Held Apr. 6-9, 1999, Denver, CO, pp. 345-352. Copyright 2000, IEE.
Paul N. Houston, Daniel F. Baldwin, Marnico Deladisma, Lawrence N. Crane, and Mark Konarski, Low Cost Flip Chip Processing and Reliability of Fast-Flow, Snap-Cure Underfills, 1999 Proceedings. 49thElectronic Components and Technology Conference. Held Jun. 1-4, 1999, San Diego, CA, pp. 61-70. Copyright 2000, IEE.
Carpenter Technology Corporation Technical Data sheet for “Carpenter Low Expansion ‘42’”, dated Nov. 1980.
Barron Richard J.
Fuller Edward Nelson
Kollipara Anil K.
Bonderer David A.
Kelsey-Hayes Company
MacMillan Sobanski & Todd LLC
Yuen Henry C.
LandOfFree
High-pressure fluid control valve assembly having a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High-pressure fluid control valve assembly having a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-pressure fluid control valve assembly having a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3036944