High precision transfer lamination mandrel

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles

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428554, 428555, 428615, 428681, 428682, 428684, 428685, B32B 1518

Patent

active

H00014486

ABSTRACT:
A high precision transfer lamination plate/mandrel is fabricated in a sanch construction design wherein an inner core is constructed of a low coefficient of thermal expansion (CTE) comprised of an iron-nickel alloy core member (e.g., Kovar or Invar) with stainless steel cladding on each side of the core member. The stainless steel is selected from AISI type 302, 304, or 316. The stainless steel cladding outer surface of the top and bottom plate to which an electroplated copper foil circuitry is applied must be free of pits, scratches, and defects so as to yield a continuous circuitry satisfactory for military electronics. A matched (CTE) of the transfer lamination plate/mandrel with a composite material to which the electronic circuitry is transferred results in adherence of the copper circuitry minimally to the plate/mandrel to avoid blistering and enables the transfer to be achieved without distortion of circuitry features due to CTE mismatch. The composite material to which the electronic circuitry is laminated is an aramid/epoxy prepreg fabric (e.g., Kevlar/epoxy prepreg fabric).

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